Power chips are connected to exterior circuits via product packaging, and their efficiency relies on the support of the packaging. In high-power situations, power chips are normally packaged as power components. Chip interconnection describes the electric link on the top surface of the chip, which is generally aluminum bonding cord in traditional components. ^
Standard power component plan cross-section
Presently, business silicon carbide power components still mostly use the packaging technology of this wire-bonded typical silicon IGBT module. They face problems such as big high-frequency parasitic criteria, not enough warmth dissipation ability, low-temperature resistance, and inadequate insulation toughness, which restrict making use of silicon carbide semiconductors. The display screen of excellent performance. In order to solve these issues and totally manipulate the massive possible advantages of silicon carbide chips, numerous brand-new packaging technologies and solutions for silicon carbide power components have emerged recently.
Silicon carbide power module bonding approach
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding products have established from gold cable bonding in 2001 to light weight aluminum cord (tape) bonding in 2006, copper wire bonding in 2011, and Cu Clip bonding in 2016. Low-power tools have developed from gold cords to copper cables, and the driving force is price reduction; high-power devices have actually established from aluminum wires (strips) to Cu Clips, and the driving force is to improve product efficiency. The higher the power, the higher the requirements.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging procedure that uses a strong copper bridge soldered to solder to connect chips and pins. Compared with standard bonding product packaging methods, Cu Clip innovation has the following benefits:
1. The link between the chip and the pins is made from copper sheets, which, to a particular level, changes the conventional cable bonding method between the chip and the pins. Therefore, a distinct bundle resistance value, higher existing circulation, and far better thermal conductivity can be acquired.
2. The lead pin welding location does not need to be silver-plated, which can totally conserve the expense of silver plating and poor silver plating.
3. The item appearance is entirely constant with typical items and is generally used in servers, mobile computers, batteries/drives, graphics cards, electric motors, power materials, and various other fields.
Cu Clip has two bonding methods.
All copper sheet bonding method
Both eviction pad and the Source pad are clip-based. This bonding approach is much more expensive and complicated, but it can accomplish much better Rdson and much better thermal effects.
( copper strip)
Copper sheet plus wire bonding technique
The source pad uses a Clip method, and eviction makes use of a Cord method. This bonding approach is a little less expensive than the all-copper bonding technique, conserving wafer location (appropriate to extremely little gateway locations). The process is simpler than the all-copper bonding method and can get far better Rdson and better thermal impact.
Provider of Copper Strip
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